<table id="0hqus"><ruby id="0hqus"></ruby></table>
  1. <pre id="0hqus"><del id="0hqus"></del></pre>
  2. 首頁 > 萬正電子 > 產品展示
    產品展示
    層數:1層
    Numberoflayers:1layer
    板厚:1.5mm
    Thickness:1.5mm
    最小孔徑:0.8m
    Min. hole:0.8mm
    材料:1mm銅基+0.5mmPTFE材料
    Base material: 1mm Copper Based
    Material+0.5mm PTFEMaterial
    技術特點:散熱、高頻
    Technical Feature: Heat dissipation, high frequency
    層數:1層
    Numberof layers:1layer
    板厚:53mm
    Thickness: 5.3mm
    最小孔徑:0.5mm
    Min.hole:0.5mm
    材料:鋁基板+PTFE
    Base material: Aluminum Based Material+PTFEMaterial
    技術特點:錫膏壓焊、高頻、散熱
    Technical Feature: Solder paste pressure elding,high frequency, heat dissipation
    層數:1層
    Numberof layers:1layer
    板厚:125mr
    Thickness:1.25mm
    最小孔徑:20mm
    Min. hole: 2.0mm
    材料:1mm銅基+0.25mmPTFE材料
    Base material: lmm Copper Based
    Material+0.25mmPTFEMaterial
    技術特點:散熱、高頻
    Technical Feature : Heat dissipation, high frequency

    層數:1層
    Number of layers: 1 layer
    板厚:53mm
    Thickness:5.3mm
    最小孔徑:3.0mm
    Min.hole:3.0mm
    材料:鋁基板+PTFE
    Base material: Aluminum Based Material
    +PTFEMaterial
    技術特點:散熱、高頻、階梯
    TechnicalFeature:Heatdissipation,high frequency,step
    層數:2層
    Numberof layers:2layers
    板厚:40mm
    Thickness:4.0mm
    最小孔徑:0.8mm
    Min. hole size:0.8mm
    材料:銅基板+PTFE
    Base material: Copper Base+PTFE
    技術特點:錫箔壓焊、高散熱、高頻
    TechnicalFeature:Tinfoil pressure welding superior heat dissipation,high frequency
    層數:1層
    Numberof layers:1layer
    板厚:1.0mm
    Thickness:1.0mm
    最小孔徑:30mm
    Min. hole: 3.0mr
    材料:鋁基板+復合陶瓷
    Base material: Aluminum Based Material
    +Composite Ceramic Material
    技術特點:高散熱
    TechnicalFeature:Superior heat
    dissipation
    首頁 上一頁 1 下一頁 末頁
    国产成人免费高清av,韩国免费a级作爱片免费观看中国,一本久久a久久免费精品不卡,亚洲色拍自偷自拍欧美